(A)期刊論文Articles (Since 2010)
1. P.T. Lee, Y.S. Wu, P.C. Lin, C.C. Chen, W.Z. Hsieh, C.E. Ho, High-speed Cu Electrodeposition and Its Solderability, Surface and Coatings Technology, vol. 320, 559–567 (2017).
2. C.C. Chen, C.H. Yang, Y.S. Wu, C.E. Ho, Depth-dependent Self-annealing Behavior of Electroplated Cu, Surface and Coatings Technology, vol. 320, 489–496 (2017).
3.陳昶志, 呂名凱, 楊政憲, 吳映璇, 何政恩, 利用原位追蹤方式探討電鍍銅的自退火行為, 鑛冶(Mining & Metallurgy), vol. 61(1), 62–74 (2017).
4. C.E. Ho, W.Z. Hsieh, C.H. Yang, P.T. Lee, Real-time Study of Electromigration in Sn Blech Structure, Applied Surface Science, vol. 388, 339–344 (2016).
5. C.E. Ho, C.C. Chen, M.K. Lu, Y.W. Lee, Y.S. Wu, In-situ Study on the Self-annealing Behavior of Electroplated Cu through the Cantilever Method, XRD, and EBSD, Surface and Coatings Technology, vol. 303, 86–93 (2016).
6. P.T. Lee, W.Z. Hsieh, T.C. Yeh, H.K. Wang, C.E. Ho, Comparative Study between Au/Pd/Cu and Au/Pd(P)/Cu Films in Soldering Applications, Surface and Coatings Technology, vol. 303, 103–111 (2016).
7. W.Z. Hsieh, M.A. Rahman, T.H. Yang, T.T. Kuo, C.E. Ho, Interfacial Microstructures and Mechanical Properties of Molten Sn Reacting with Ni-xP Films, Surface and Coatings Technology, vol. 303, 112–118 (2016).
8. C.E. Ho, C.C. Chen, M.K. Lu, Y.W. Lee, Y.S. Wu, In-situ Study on the Self-annealing Behavior of Electroplated Cu through the Cantilever Method, XRD, and EBSD, Surface and Coatings Technology, vol. 303, 86–93 (2016).
9. C.E. Ho, W.Z. Hsieh, C.H. Yang, P.T. Lee, Real-time Study of Electromigration in Sn Blech Structure, Applied Surface Science, vol. 114, 79–83 (2016).
10. C.E. Ho, P.T. Lee, C.N. Chen, C.H. Yang, Electromigration in 3D-IC Scale Cu/Sn/Cu Solder Joints, Journal of Alloys and Compounds, vol. 676, 361–368 (2016).
11. 張景勛, 陳昶志, 呂名凱, 何政恩, 利用EBSD分析電流密度對盲孔中電鍍銅微結構的影響, 鑛冶(Mining & Metallurgy), vol. 60(1), 100–110 (2016).
12. C.E. Ho, C.H. Yang, P.T. Lee, C.T. Chen, Real-time X-ray Microscopy Study of Electromigration in Microelectronic Solder Joints, Scripta Materialia, vol. 114, 79–83 (2016).
13. C.C. Chen, C.H. Hsieh, Y.W. Lee, C.H. Yang, C.E. Ho, Formation Mechanism of Pinholes in Electroplated Cu Films and Its Mitigation, Thin Solid Films, vol. 596, 209–215 (2015).
14. C.E. Ho, C.H. Yang, C.T. Chen, B.Z. Chen, Abnormal Depletion of Cu Metallization Pads in Line-bump-line Solder Joints under Electron Current Stressing, Thin Solid Films, vol. 596, 216–221 (2015).
15. C.E. Ho, C.C. Chen, L.H. Hsu, M.K. Lu, Electron Backscatter Diffraction Characterization of Electrolytic Cu Deposition in the Blind-hole Structure: Current Density Effect, Thin Solid Films, vol. 584, 78–84 (2015).
16. C.E. Ho, L.H. Hsu, C.H. Yang, T.C. Yeh, P.T. Lee, Effect of Pd(P) Thickness on the Soldering Reaction between Sn-3Ag-0.5Cu Alloy Ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu Metallization Pad, Thin Solid Films, vol. 584, 257–264 (2015).
17. C.E. Ho, W.Z. Hsieh, T.H. Yang, Depletion Phase Transformation of a Submicron Ni(P) Film in the Early Stage of Soldering Reaction between Sn-Ag-Cu Au/Pd(P)/Ni(P)/Cu, Electronic Materials Letters, vol. 11, 155–163 (2015).
18. C.E. Ho. W.Z. Hsieh, C.H. Yang, T.C. Yeh, T.T. Kuo, Interfacial Reaction Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition, Journal of Electronic Materials, vol. 44, 568–580 (2015).
19. 陳昶志, 張景勛, 許令煌, 呂名凱, 何政恩, 利用EBSD分析盲孔填充之各階段的電鍍銅微結構, 鑛冶(Mining & Metallurgy), vol. 58(4), 45–54 (2014).
20. 陳昶志, 呂名凱, 謝宛蓁, 許令煌, 何政恩, 利用EBSD分析通孔填充之各階段的電鍍銅微結構：蝴蝶沉積模式, 鑛冶(Mining & Metallurgy), vol. 58(1), 62–69 (2014).
21. C.E. Ho, W.Z. Hsieh, C.S. Liu, C.H. Yang, Theoretical Experimental Determination of Cu Diffusivity in Eutectic Sn-Ag System at 235–280 °C, Thin Solid Films, vol. 572, 238–244 (2014).
22. C.E. Ho, W.Z. Hsieh, C.W. Fan, Pronounced Effects of Ni(P) Thickness on the Interfacial Reaction High Impact Resistance of the Solder/Au/Pd(P)/Ni(P)/Cu Reactive System, Surface & Coatings Technology, vol. 259, 244–251 (2014).
23. M.A. Rahman, C.E. Ho, W. Gierlotka; J.C. Kuo, Experimental Determination Thermodynamic Modeling of the Sn-rich Corner of the Ternary Ni-Pd-Sn Phase Diagram at 250 °C, Journal of Electronic Materials, vol. 43, 4582–4593 (2014).
24. C.E. Ho, L.H. Hsu, C.C. Chen, M.K. Lu, Electron Backscatter Diffraction Characterization of Blind Hole Fillings by Electrolytic Cu Deposition, Thin Solid Films, vol. 572, 232–237 (2014).
25. C.E. Ho, W.Z. Hsieh, C.C. Chen, M.K. Lu, Electron Backscatter Diffraction Analysis on the Microstructures of Electrolytic Cu Deposition in the Through Hole Filling Process: Butterfly Deposition Mode, Surface & Coatings Technology, vol. 259 262–267 (2014).
26. C.E. Ho, C.H. Yang, L.H. Hsu, Electromigration in Thin-film Solder Joints, Surface & Coatings Technology, vol. 259, 257–261 (2014).
27. C.E. Ho, S.J. Wang, C.W. Fan, W.H. Wu, Optimization of the Ni(P) Thickness f an Ultrathin Ni(P)-based Surface Finish in Soldering Applications, Journal of Electronic Materials, vol. 43, 16–25 (2014).
28. M.A. Rahman, C.W. Fan, S.J. Wang, C.E. Ho, W. Gierlotka, Experimental Study Thermodynamic Assessment of Ternary Cu-Pd-Sn Phase Relations Focused on the Sn-rich Alloys, Journal of Electronic Materials, vol. 43 176–185 (2014).
29. S.J. Wang, L.H. Hsu, N.K. Wang, C.E. Ho, EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps during Isothermal Annealing, Journal of Electronic Materials, vol. 43, 219–228 (2014).
30. C.H. Kuo, H.H. Hua, H.Y. Chan, T.H. Yang, K.S. Lin, C.E. Ho, Interfacial Reaction Mechanical Reliability of PTH Solder Joints with Different Solder/Surface Finish Combinations, Microelectronics Reliability, vol. 53, 2012–2017 (2013).
31. C.E. Ho, C.W. Liao, C.X. Pan, H.J. Chen, J.C. Kuo, D. Chen, Electron Backscatter Diffraction Analysis on the Microstructures of Electrolytic Cu Deposition in the Through Hole Filling Process, Thin Solid Films, vol. 544, 412–418 (2013).
32. C.E. Ho, Y.C. Lin, S.J. Wang, Sn-Ag-Cu Solder Reaction with Au/Pd/Ni(P) Au/Pd(P)/Ni(P) Platings, Thin Solid Films, vol. 544, 551–556 (2013).
33. C.E. Ho, C.C. Wang, M.A. Rahman, Y.C. Lin, Field-Emission Transmission Electron Microscopy Study of the Reaction Sequence between Sn-Ag-Cu Alloy an Amorphous Pd(P) Thin Film in Microelectronic Packaging, Thin Solid Films, vol. 529, 369–373 (2013).
34. C.E. Ho, C.W. Fan, W.H. Wu, T.T. Kuo, Reliability Evaluation on a Submicron Ni(P) Thin Film f Lead-Free Soldering, Thin Solid Films, vol. 529, 364–368 (2013).
35. 何政恩, 廖成偉, 花馨慧, 陳宏杰, 利用EBSD分析通孔填充之各階段的電鍍銅微結構,鑛冶(Mining & Metallurgy), vol. 57, 125–130 (2013).
36. C.E. Ho, T.T. Kuo, W. Gierlotka, F.M. Ma, Development Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications, Journal of Electronic Materials, vol. 41, 3276–3283 (2012).
37. C.E. Ho, W.H. Wu, C.C. Wang, Y.C. Lin, Gold Palladium-Induced Embrittlement Phenomenon in Microbumps with Au/Pd(P)/Ni(P) Metallization Pads, Journal of Electronic Materials, vol. 41, 3266–3275 (2012).
38. C.E. Ho, T.T. Kuo, C.C. Wang, W.H. Wu, Inhibiting the Growth of Cu3Sn Kirkendall Voids in the Cu/Sn-Ag-Cu System by Min Pd Alloying, Electronic Materials Letters, vol. 8, 495–501 (2012).
39. W.H. Wu, S.W. Lin, Y.C. Lin, C.E. Ho, Solder Volume Effect on the Microstructure of Solder Joints Using Au/Pd(P)/Ni(P) Surface Finish, Procedia Engineering, vol. 36, 419–426 (2012).
40. C.E. Ho, L.H. Hsu, S.W. Lin, M.A. Rahman, Influence of Pd Concentration on the Interfacial Reaction Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System, Journal of Electronic Materials, vol. 41, 2–10 (2012).
41. C.E. Ho, W.H. Wu, L.H. Hsu, C.S. Lin, Solid-Solid Reaction between Sn-3Ag-0.5Cu Alloy Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses, Journal of Electronic Materials, vol. 41, 11–21 (2012).
42. C.S. Liu, C.E. Ho, C.S. Peng, C.R. Kao, Effects of Joining Sequence on the Interfacial Reactions Substrate Dissolution Behaviors in Ni/Solder/Cu Joints, Journal of Electronic Materials, vol. 40, 1912–1920 (2011).
43. C.E. Ho, S.W. Lin, Y.C. Lin, Effects of Pd Concentration on the Interfacial Reaction Mechanical Reliability of the Sn-Pd/Ni System, Journal of Alloys Compounds, vol. 509, 7749–7757 (2011).
44. D. Chen, C.E. Ho, J.C. Kuo, Current Stressing-induced Growth of Cu3Sn in Cu/Sn/Cu Solder Joints, Materials Letters, vol. 65, 1276–1279 (2011).
45. W.H. Wu, H.L. Chung, B.Z. Chen, C.E. Ho, Critical Current Density for Inhibiting the (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints, Journal of Electronic Materials, vol. 39, 2653–2661 (2010).
46. C.E. Ho, W. Gierlotka, S.W. Lin, Strong Effect of Pd Concentration on the Soldering Reaction between Ni Sn-Pd Alloys, Journal of Materials Research, vol. 25, 2078–2081 (2010).
47. W.H. Wu, C.S. Lin, S.H. Huang, C.E. Ho, Influence of Palladium Thickness on the Soldering Reactions between Sn-3Ag-0.5Cu Au/Pd(P)/Ni(P) Surface Finish, Journal of Electronic Materials, vol. 39, 2387–2396 (2010).
48. S.P. Peng, W.H. Wu, C.E. Ho, Y.M. Huang, Comparative Study between Sn37Pb Sn3Ag0.5Cu Soldering with Au/Pd/Ni(P) Tri-layer Structure, Journal of Alloys Compounds, vol. 493, 431–437 (2010).
(B)會議論文Conference Publications (Since 2010)
1. Y.S. Wu, P.T. Lee, W.Y. Shih, S.W. Lin, C.E. Ho, Strong Effect of Plating Current Density on the Cu Pillar Microstructure and Its Adhesion with An ABF Substrate, Proceeding of the 14th Electronic Circuits World Convention (ECWC14), Paper Code: PKO–1 (2017).
2. P.T. Lee, Y.S. Wu, Y.H. Weng, S.W. Lin, C.E. Ho, Solderability between Sn-3Ag-0.5Cu Alloy and Cu Pillars Deposited via Different Plating Current Densities, Proceeding of the 14th Electronic Circuits World Convention (ECWC14), Paper Code: STO–1 (2017).
3. 吳映璇, 陳昶志, 李育維, 何政恩, In-situ Characterization on the Self-annealing Behavior of Electroplated Cu, 2016中國材料年會論文集, Article number: 528 (2016).
4. 謝宛蓁, 李珮慈, 郭蔡同, 何政恩, Interdiffusion of Au/Pd/Cu and Au/Pd(P)/Cu Couples at 180 °C, 2016中國材料年會論文集, Article number: 543 (2016).
5. 李珮慈, 陳昶志, 吳映璇, 林品仲, 何政恩, Effects of Plating Current Density on the Cu Microstructure and Solderability, 2016中國材料年會論文集, Article number: 548 (2016).
6. 楊政憲, 吳映璇, 陳昶志, 何政恩, Self-annealing of Electroplated Cu: Bottom-up Growth Behavior, 2016中國材料年會論文集, Article number: 643 (2016).
7. P.T. Lee, C.C. Chen, Y.S. Wu, P.C. Lin, C.E. Ho, High-Current-Density Electroplating Cu and Its Solderability, Proceeding of the 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2016), 318–321 (2016).
8. Y.S. Wu, C.C. Chen, P.T. Lee, H.C. Liu, C.E. Ho, Microstructure and Its Reliability of High-speed Cu Electrodeposition, Proceeding of the 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2016), 220–223 (2016).
9. C.E. Ho, W.Z. Hsieh, P.T. Lee, T.T. Kuo, Reliability Testing of Au/Pd/Cu and Au/Pd(P)/Cu Surface Finishes at High Temperature Storage, Proceeding of the 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2016), 367–370 (2016).
10. 楊政憲, 陳智琮, 陳柏宗, 何政恩, 電遷移引發覆晶銲點內之金屬銲墊異常消耗現象, 2015中國材料年會論文集, Article number: 429 (2015).
11. 何政恩, 楊政憲, 陳志南, 李育維, 在超薄型銲點尺度下之Cu6Sn5的異常生長行為, 2015中國材料年會論文集, Article number: 430 (2015).
12. 呂名凱, 李珮慈, 謝宛蓁, 何政恩, 銅濃度效應對Sn-3Ag-xCu/Ni銲點之機械可靠度的影響, 2015中國材料年會論文集, Article number: 518 (2015).
13. 李珮慈, 謝宛蓁, 呂名凱, 何政恩, 不同磷含量之鈀薄膜對銲接可靠度的影響, 2015中國材料年會論文集, Article number: 521 (2015).
14. C.H. Yang, C.T. Chen, Y.W. Lee, C.E. Ho, 3D X-ray Computed Microtomograpic (μ-CT) Study of Electromigration in Micro Joints, Proceeding of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2015), 567–570 (2015).
15. W.Z. Hsieh, P.T. Lee, C.E. Ho, Electromigration in Tin Blech Structure, Proceeding of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2015), 458–461 (2015).
16. C.E. Ho, C.H. Yang, W.Z. Hsieh, B.Z. Chen, Unusual Cu Depletion in Line-bump Solder Joints under Current Stressing, Proceeding of the 9th International Microsystems, Packaging, Assembly Circuits Technology Conference the 16th International Conference on Electronics Materials Packaging (IMPACT-EMAP 2014) 372 (2014).
17. C.C. Chen, L.H. Hsu, M.K. Lu, C.E. Ho, Microstructural Crystallographic Evolutions of Electroplating Cu in Blind Hole Structure, Proceeding of the 9th International Microsystems, Packaging, Assembly Circuits Technology Conference the 16th International Conference on Electronics Materials Packaging (IMPACT-EMAP 2014) 373–376 (2014).
18. W.Z. Hsieh, T.H. Yang, W.H. Wu, Y.W. Lee, C.E. Ho, Correlation between Ni(P) Depletion IMCs Formation in Microelectronic Solder Joints with A Submicron Ni(P) Surface Finish, Proceeding of the 9th International Microsystems, Packaging, Assembly Circuits Technology Conference the 16th International Conference on Electronics Materials Packaging (IMPACT-EMAP 2014) 233–236 (2014).
19. S.J. Wang, C.W. Fan, T.T. Kuo, C.E. Ho, Reliability Evaluation on ENEPIG, Ultrathin Ni(P), EPIG Surface Finishes in Soldering Applications, Proceeding of the 8th International Microsystems, Packaging, Assembly Circuits Technology Conference (IMPACT 2013), 236–239 (2013).
20. C.W. Fan, C.C. Chen, M.K. Lyu, L.H. Hsu, C.E. Ho, Investigation of Through Hole Filling by Electrolytic Cu Deposition Using Electron Backscatter Diffraction, Proceeding of the 8th International Microsystems, Packaging, Assembly Circuits Technology Conference (IMPACT 2013), 466–469 (2013).
21. C.E. Ho, L.H. Hsu, T.H. Yang, C.N. Chen, Unusual IMC Growth in 3D-IC Solder Joints, Proceeding of the 8th International Microsystems, Packaging, Assembly Circuits Technology Conference (IMPACT 2013), 364–367 (2013).
22. 王年康, 王詩茹, 許令煌, 何政恩, 利用EBSD及TEM分析Cu-Sn介金屬於晶片接點之微結構及相轉變, 2013中國材料年會論文集, Article number: 321 (2013).
23. 楊宗勳, 楊政憲, 陳志南, 何政恩, 3D IC銲點尺度下之電遷移行為探討, 2013中國材料年會論文集, Article number: 322 (2013).
24. 呂名凱, 劉晏初, 陳昶志, 陳宏杰, 何政恩, 電子背向散射繞射(EBSD)分析通孔(PTH)填充之電鍍銅生長行為, 2013中國材料年會論文集, Article number: 422 (2013).
25. 王詩茹, 李筱舲, 林彥辰, 何政恩, 純Pd與Pd(P)薄膜用於微電子接點之銲接可靠度評估, 2013中國材料年會論文集, Article number: 656 (2013).
26. 范家瑋, 王詩茹, 巫維翔, 何政恩, 以高解析穿透式電子顯微鏡研究次微米Ni(P)薄膜之各階段銲接反應機構, 2012中國材料年會論文集, 1205–1208(2012).
27. 郭蔡同, 吳昱輝, 馬鳳梅, 巫維翔, 何政恩, 直接鈀金鍍層用於銅銲墊之無鉛銲接之研究, 2012中國材料年會論文集, 1221–1224 (2012).
28. 花馨慧, 巫維翔, 何政恩, 鎳/鈀/金薄膜墊層用於不同尺寸銲點之可靠度評估, 2012中國材料年會論文集, 1225–1228 (2012).
29. 郭蔡同, 楊政憲, 葉庭均, 何政恩, 利用添加Pd以減緩Cu3Sn及Kirkendall Voids生長的方法, 2012中國材料年會論文集, 1229–1232 (2012).
30. C.W. Liao, C.H. Kuo, K.S. Lin, Y.C. Lin, C.E. Ho, Microstructures Mechanical Properties of Lead-free Solder Joints in Pin Through Hole Components, 2012年海峽兩岸破壞科/材料試驗學術會議論文集, Article number: 050 (2012).
31. C.H. Kuo, K.S. Lin, L.H. Hsu, C.E. Ho, Microstructural Mechanical Analyses on the Rework Lead-Free Pin Through Hole (PTH) Components, Proceeding of the 7th International Microsystems, Packaging, Assembly Circuits Technology Conference (IMPACT 2012), 194–197 (2012).
32. M.A. Rahman, Y.C. Lin, C.C. Wang, C.E. Ho, On the Reaction Mechanism between Sn-Ag-Cu Alloy Amorphous Pd(P) Thin Film in Microelectronic Packaging, Proceeding of the 7th International Microsystems, Packaging, Assembly Circuits Technology Conference (IMPACT 2012), 546–549 (2012).
33. C.W. Fan, H.K. Wang, C.E. Ho, Investigation of A Submicron Ni(P) Thin Film in the Soldering Application by FE-TEM, Proceeding of the 7th International Microsystems, Packaging, Assembly Circuits Technology Conference (IMPACT 2012), 614–617 (2012).
34. Y.C. Lin, W.H. Wu, C.W. Fan, C.E. Ho, Effect of Isothermal Aging on the Microstructural Evolution in Microbumps with An Au/Pd(P)/Ni(P) Surface Finish, Proceeding of the 12th Electronic Circuits World Convention (ECWC12), 268–271 (2011).
35. C.N. Chen, B.Z. Chen, L.H. Hsu, C.E. Ho, Pronounced Effect of Ag Content on the Pad Consumption in Lead-free Sn-Ag-Cu Solder Joints under Electron Current Stressing, Proceeding of the 12th Electronic Circuits World Convention (ECWC12), 277–280 (2011).
36. W.H. Wu, S.W. Lin, Y.C. Lin, C.E. Ho, Solder Volume Effect on the Microstructure of Solder Joints Using Au/Pd(P)/Ni(P) Surface Finish, Proceeding of IUMRS-ICA 2011 (12th International Conference in Asia), Article number: 289 (2011).
37. C.S. Liu, C.M. Li, C.E. Ho, Theoretical Experimental Determination of the Cu Diffusivity in the Molten Eutectic Sn-Ag System, Proceeding of IUMRS-ICA 2011 (12th International Conference in Asia), Article number: 569 (2011).
38. C.N. Chen, B.Z. Chen, W.H. Wu, C.E. Ho, Correlation between Ag Content Cu Pad Consumption in Lead-Free Solder Joints under Electron Current Stressing, Proceeding of 2011 International Conference on Electronic Packaging Technology High Density Packaging (ICEPT-HDP), 846–850 (2011).
39. S.W. Lin, C.E. Ho, Soldering Reaction between Ni Sn-Pd Alloys with Various Pd Concentrations, Proceeding of the 2010 International Electron Devices Materials Symposia (IEDMS), Article number: 242 (P-B-29) (2010).
40. 陳柏宗, 林彥辰, 鐘涵琳, 何政恩, 錫在Cu6Sn5介金屬相之電遷移行為之研究, 2010中國材料年會論文集, Article number: P03-0796 (2010).
41. 陳志南, 黃淑惠, 何政恩, 在先進覆晶銲點尺度下觀察β-Sn於電流應力中的微結構變化, 2010中國材料年會論文集, Article number: P03-0910 (2010).
42. C.S. Liu, C.E. Ho, Role of Ni Cu Metallization Dissolution in Various Ni/Solder/Cu Jointing Sequences, Proceeding of the 5th International Microsystems, Packaging, Assembly Circuits Technology Conference (IMPACT 2010), Article number: TW143-1 (2010).
43. W.H. Wu, H.L. Chung, N. Lee, R. Peng, C.E. Ho, A Study on the Soldering Reaction between Sn3Ag0.5Cu Electrolytic-Ni Coated with A Au/Pd(P) Bilayer Surface Finish, Proceeding of the 5th International Microsystems, Packaging, Assembly Circuits Technology Conference (IMPACT 2010), Article number: TW079-1 (2010).
44. D. Chen, C.E. Ho, J.C. Kuo, EBSD Characterization of Sandwich Layers Formed in Cu/Sn/Cu Joint, Proceeding of Thin Films 2010 COMPO 2010, 205–208 (2010).
(C)其它著作Others (Since 2008)
C1 雜誌文章Article in Magazine:
1. 楊政憲, 呂名凱, 謝宛蓁, 施威言, 郭蔡同, 何政恩, 由焊接角度剖析各式銅表面處理技術的可靠度－鈀膜厚度對Sn-3.5Ag焊接及銲點老化之影響, 台灣電路板會刊(TPCA Magazine), 第74期, 54–67 (2016).
2. 李珮慈, 呂名凱, 葉庭均, 吳映璇, 何政恩, 由焊接角度剖析各式銅表面處理技術的可靠度－銲料中之P元素濃度對焊接的影響, 台灣電路板會刊(TPCA Magazine), 第72期, 37–45 (2016).
3. 葉庭均, 李珮慈, 王孝耕, 何政恩, 由焊接角度剖析各式銅表面處理技術的可靠度－Au/Pd/Cu vs. Au/Pd(P)/Cu (直接鈀金) (III), 台灣電路板會刊(TPCA Magazine), 第69期, 29–39 (2015).
4. 葉庭均, 謝宛蓁, 郭蔡同, 洪暉程, 何政恩, 由焊接角度剖析各式銅表面處理技術的可靠度－Au/Pd(P)/Cu (直接鈀金) (II), 台灣電路板會刊(TPCA Magazine), 第67期, 24–35 (2015).
5. 謝宛蓁, 林彥辰, 吳昱輝, 何政恩, 由焊接角度剖析各式銅表面處理技術的可靠度－Au/Pd/Ni(P)及Au/Pd(P)/Ni(P) (ENEPIG), 台灣電路板會刊(TPCA Magazine), 第64期, 30–36 (2014).
6. 何政恩, 范家瑋, 楊政憲, 巫維翔, 郭蔡同, 由焊接角度剖析各式銅表面處理技術的可靠度－鈀薄膜(鈀濃度)對焊接反應的影響, 台灣電路板會刊(TPCA Magazine), 第62期, 20–29 (2013).
7. 何政恩, 范家瑋, 巫維翔, 王詩茹, 由焊接角度剖析各式銅表面處理技術的可靠度－Au/Ni(P)及Au/Pd(P)/Ni(P) (薄鎳型), 台灣電路板會刊(TPCA Magazine), 第59期, 40–48 (2013).
8. 楊政憲, 謝峻誠, 何政恩, Inhibiting the Growth of Cu3Sn Kirkendall Voids in the Cu/Sn-Ag-Cu System by Min Pd Alloying, Journal of Engineering (Yuan Ze University), vol. 4, 71–78 (2012).
9. 巫維翔, 郭蔡同, 王孝耕, 何政恩, 由焊接角度剖析各式銅表面處理技術的可靠－Au/Pd(P)/Cu (直接鈀金) (I), 台灣電路板會刊(TPCA Magazine), 第57期, 33–41 (2012).
10. 何政恩, 林呈軒, 巫維翔, 由銲接角度看Ni/Au表面處理轉換成Ni/Pd/Au可能遭遇的挑戰, SMT Solution-Solution Tool, 17–24 (2009).
11. 林呈軒, 巫維翔, 莊育傑, 林定皓, 何政恩, 微電子Au/Pd/Ni(P)薄膜用於晶片載板之可靠度評估: SAC305銲料與Au/Pd/Ni(P)銲墊之界面性質之研究, (2009).
C2專書Books:
1. C.E. Ho, C.R. Kao, K.N. Tu, Interfacial Reactions Electromigration in Flip-Chip Solder Joints, inAdvanced Flip Chip Packaging (Ed. Ho-Ming Tong, Yi-Shoa Lai, C. P. Wong), Springer, New Yk, 503–560 (2013).
C3專利Patents:
1. 何政恩, 楊政憲, 許令煌, 用於三維X光斷層掃描裝置的可調式夾具結構, 中華民國發明專利, I545316 (2016).
2. 何政恩, 楊政憲, 許令煌, Adjustable Fixture Structure for 3-dimensional X-ray Computed Tomography, US Patent, Patent No. US9194822B2 (2015).
3. 何政恩, 王詩茹, 吳昱輝, 具多層介金屬層的銲點結構, 中華民國發明專利, I503196 (2015).
4. 何政恩, 王詩茹, 吳昱輝, Solder Joint with A Multilayer Intermetallic Compound Structure, US Patent, Patent No. US9079272B2 (2015).
5. 何政恩, 抑制柯肯達爾孔洞形成於銲料與銅銲墊之間的方法, 中華民國發明專利, I464031 (2014).
6. 何政恩, 陳柏宗, 陳志南, Method f Controlling Beta-Sn orientation in Solder Joints, US Patent, Patent No. US8702878B2 (2014).
7. 何政恩, 陳柏宗, 陳志南, 一種控制銲點結構中錫晶體結構取向的方法, 中華民國發明專利, I404588 (2013).
8. 何政恩, 林祈明, 抑制錫-鎳介金屬於銲點中生成的方法, 中華民國發明專利, I381901 (2013).
9. 何政恩, 林祈明, Method f Inhibiting Growth f Nickel-Copper-Tin Intermetallic Layer in Solder Joints, US Patent, Patent No.US8092621B2 (2012).
10. 何政恩, 鐘涵琳, 高速推球機, 中華民國發明專利, I387414 (2013).
11. 何政恩, 巫維翔, 林呈軒, 抑制鈀-鎳-錫介金屬於銲點中生成的方法, 中華民國發明專利, I359714 (2012).
12. 何政恩, 巫維翔, 抵消電遷移的方法, 中華民國發明專利, I362079 (2012).
13. 何政恩, 巫維翔, Inhibiting Electromigration-induced Phase Segregation in Solder Joints, US Patent, Patent No. US8207469B2 (2012).
14. 何政恩, 鐘涵琳, High Speed Ball Shear Machine, US Patent, Patent No. US7950565B2 (2011).
15. 何政恩, 巫維翔, 抵消電遷移的方法, 中國發明專利, ZL200810095528.6 (2010)
(D)得獎(Since 2008)
1.元智大學「工學院104學年度教師績效研究傑出獎」(2017)
2. Y.S. Wu, P.T. Lee, W.Y. Shih, S.W. Lin, C.E. Ho, 2017 ECWC Best Paper Award (2017).
3. 科技部「優秀年青學者研究計畫」(MOST105-2628-E-155-001-MY3) (2016).
4. 科技部105年度補助大專校院獎勵特殊優秀人才 (2016).
5. 元智大學「工學院103學年度教師績效研究傑出獎」(2016).
6. Y. S. Wu, C. C. Chen, P. T. Lee, H. C. Liu, and C. E. Ho, 2016 PCB Student Best Paper Award (Gold Prize-the 1st place) & 2016 IMPACT Student PCB Paper Award (此論文同時獲得兩項殊榮) (2016).
7. P. T. Lee, C. C. Chen, Y. S. Wu, P. C. Lin, and C. E. Ho, 2016 PCB Student Best Paper Award (Quality Award) (2016).
8. 科技部104年度補助大專校院獎勵特殊優秀人才 (2015).
9. 國際期刊Materials & Design (Elsevier)評為「傑出評審員(Outstanding Reviewer)」(2015).
10. P.T. Lee, W.Z. Hsieh, T.C. Yeh, H.K. Wang, C.E. Ho, TACT2015 Poster Award of Merit (2015).
11. 楊政憲, 陳智琮, 陳柏宗, 何政恩, 2015中國材料年會－電子介電封裝材料組論文「佳作」 (2015).
12. 何政恩, 楊政憲, 陳志南, 李育維, 2015中國材料年會－電子介電封裝材料組論文「優等」 (2015).
13. 李珮慈, 謝宛蓁, 呂名凱, 何政恩, 2015中國材料年會－電子介電封裝材料組論文「優等」 (2015).
14. W.Z. Hsieh, P.T. Lee, C.E. Ho, 2015 PCB Student Paper Award (Merit) & 2015 IMPACT Best Student Paper Award (此論文同時獲得兩項殊榮) (2015).
15. 元智大學「工學院102學年度教師績效研究傑出獎」(2015).
16. 國科會103年度補助大專校院獎勵特殊優秀人才 (2014).
17. C.E. Ho, C.H. Yang, W.Z. Hsieh, B.Z. Chen, 2014 IMPACT Outstanding PCB Thesis Award (Merit) (2014).
18. C.C. Chen, L.H. Hsu, M.K. Lu, and C.E. Ho, 2014 IMPACT Outstanding PCB Thesis Award (Merit) (2014).
19. 102學年度元智大學「研究傑出獎」(2013).
20. 國科會工程處102年度技術及知識應用型產學合作計畫之成果發表暨績效考評－產學成果優良獎 (2013).
21. S.J. Wang, C.W. Fan, T.T. Kuo, C.E. Ho, 2013 IMPACT Outstanding Paper Award (Merit Prize-3rd place on PCB field) (2013).
22. C.E. Ho, L.H. Hsu, T.H. Yang, C.N. Chen, 2013 IMPACT Outstanding Paper Award (Gold Prize-1st place on PCB field) (2013).
23. 王年康, 王詩茹, 許令煌, 何政恩, 2013中國材料年會-電子材料組論文優等 (2013).
24. 楊宗勳, 楊政憲, 陳志南, 何政恩, 2013中國材料年會-電子材料組論文佳作 (2013).
25. C.E. Ho, C.W. Fan, S.J. Wang, W.H. Wu, TACT2013 Poster Award (2013).
26. 何政恩, 廖成偉, 花馨慧, 陳宏杰, 中國礦冶工程學會101年「礦冶論文佳作獎」 (2013).
27. 郭蔡同, 楊政憲, 葉庭均, 何政恩, 2012中國材料年會-電子材料組論文佳作 (2012).
28. 國科會工程處101年度技術及知識應用型產學合作計畫之成果發表暨績效考評－海報展示優良獎 (2012).
29. 國科會101年度補助大專校院獎勵特殊優秀人才 (2012).
30. M.A. Rahman, Y.C. Lin, C.C. Wang, C.E. Ho, 2012IMPACT Best Student Paper Award (2012).
31. 2012台北國際發明暨技術交易展發明競賽金牌(高速推球機-錫球捕捉器, 美國專利號：US7950565B2).
32. 2012台北國際發明暨技術交易展發明競賽銅牌。(抑制鈀-鎳-錫介金屬於銲點中生成的方法, 中華民國專利號：I359714).
33. The Young Scholar Research Award of 2011 (青年學者研究獎).
34. Y. C. Lin, W. H. Wu, C. W. Fan, C. E. Ho, Outstanding PCB Thesis Award-Gold Prize (1st Place), (2011).
35. C. N. Chen, B. Z. Chen, L. H. Hsu, C. E. Ho, Outstanding PCB Thesis Award-Merit Prize, (2011).
36. C. N. Chen, B. Z. Chen, W. H. Wu, C. E. Ho, ICEPT-HDP (IEEE symposium) Outstanding Paper Award (Section: Quality & Reliability), (2011).
37. W. H. Wu, H. L. Chung, N. Lee, R. Peng, C. E. Ho, Outstanding PCB Thesis Award-Gold Prize (1st Place), (2010).
38. C. S. Liu C. E. Ho, Outstanding PCB Thesis Award-Merit Prize, (2010).
39. 陳柏宗, 林彥辰, 鐘涵琳, 何政恩, 中國材料年會-電子材料組論文佳作獎, (2010).
40. D. Chen, C. E. Ho, J. C. Kuo, 2010 Top 10 Prize in the Poster Competition in Proceeding of Thin Films 2010 COMPO 2010, (2010).
41. W. H. Wu C. E. Ho, Outstanding PCB Thesis Award-Merit Prize (2nd Place), (2009).
42. 巫維翔, 鐘涵琳, 何政恩,中國材料年會-電子材料組論文優等獎, (2008).
(E)近六年計畫Project List (Since 2010)
| 年度 | 計劃編號 | 計劃名稱 | 委託單位 | 主持人 |
| 105 | MOST105-2628-E-155-001-MY3 | 微米尺度之先進晶片接點技術及其可靠度評估 | 科技部 | 何政恩 |
| 105 | MOST105-2221-E-155-006-MY2 | 高密度互連印刷電路板之銅填孔微結構演進及其改良計畫 | 科技部 | 何政恩 |
| 105 | MOST105-2622-E-155-011-CC2 | 印刷電路板鍍金製程之效率提升與金回收技術之研發 | 科技部及臻鼎科技股份有限公司 | 李碩仁, 林錕松, 謝建德, 何政恩 |
| 105 | YZU-RD1050336 | 委託協助推動電路板製程工程師能力鑑定校園應用(基礎型) | 工研院 | 何政恩 |
| 104 | MOST104-2221-E-155-007 | 電鍍銅填孔行為、針孔缺陷生成機制及其微結構改良計畫 | 科技部 | 何政恩 |
| 103 | MOST103-2221-E-155-010 | 適於超細微導線及導線間距之新型表面處理技術 | 科技部 | 何政恩 |
| 103 | MOST104-2622-E-155-001 | 高階電路板技術深耕及人才培育發展計畫(3/3) | 科技部 | 何政恩 |
| 103 | TTNSC103002 | 用於三維X光斷層掃描裝置的可調式夾具結構 | 實密科技股份有限公司 | 何政恩 |
| 102 | NSC102-2622-E-155-004 | 高階電路板技術深耕及人才培育發展計畫(1/3) | 國科會 | 何政恩 |
| 102 | NSC103-2622-E-155-001 | 高階電路板技術深耕及人才培育發展計畫(2/3) | 國科會 | 何政恩 |
| 101 | CEP-101001 | 印刷電路板製程 | 台灣電路板協會 | 何政恩 |
| 101 | CEP-101002 | 利用穿透式電子顯微鏡及高速推球測試評估Au/Pd及Au/Pd(P)表面處理之銲接特性 | 景碩科技股份有限公司 | 何政恩 |
| 101 | NSC100-2221-E-155-018-MY3 | 三維積體電路封裝之微型銲點可靠度評估：不同銲料厚度之界面反應及電遷移行為 | 國科會 | 何政恩 |
| 101 | NSC101-2622-E-155-009-CC3 | 直接鈀金鍍層用於銅銲墊之無鉛銲接可靠度評估 | 國科會 | 何政恩 |
| 101 | NSC102-2622-E-155-004 | 高階電路板技術深耕及人才培育發展計畫 | 國科會 | 何政恩 |
| 100 | NSC100-2221-E-155-018-MY3 | 三維積體電路封裝之微型銲點可靠度評估：不同銲料厚度之界面反應及電遷移行為 | 國科會 | 何政恩 |
| 99 | NSC99-2221-E-155-017 | 鎳/鈀/金薄膜墊層用於CSP-BGA/Flip-Chip等微小銲點之可靠度研究 | 國科會 | 何政恩 |
| 99 | NSC99-2622-E-155-008-CC3 | 鈀金屬薄膜引發介金屬大規模剝落與抑制方法的評估 | 國科會 | 何政恩 |
